Raspberry Pi Pico 2 W with Pre‑Soldered Headers – Wireless Microcontroller Board with RP2350 Dual ARM Cortex‑M33 & RISC‑V Cores @150 MHz, 520 KB SRAM, 4 MB Flash, Integrated Wi‑Fi & Bluetooth, 26 GPIO, USB 1.1 – Ideal for IoT & Embedded Projects

The Raspberry Pi Pico 2 W with Header is a next‑generation wireless microcontroller board built around the powerful RP2350 dual‑core architecture, combining dual ARM Cortex‑M33 cores and dual RISC‑V Hazard3 cores running at up to 150 MHz. This advanced platform delivers superior processing performance for real‑time embedded applications, data handling, and multitasking workloads, making it ideal for modern IoT and connected projects. (robu.in ) This version comes with pre‑soldered male headers, allowing you to plug the board directly into breadboards and quickly connect external modules, sensors, and accessories without additional soldering. The board integrates 2.4 GHz Wi‑Fi (802.11 b/g/n) and Bluetooth 5.2, so you can build wireless applications such as remote sensors, smart home controllers, and networked devices right out of the box. (robu.in ) Featuring 520 KB of SRAM and 4 MB of onboard flash memory, the Pico 2 W provides ample memory resources for complex firmware and data‑rich tasks. Its 26 multifunction GPIO pins support standard interfaces like UART, SPI, I2C, PWM, and ADC for connecting a wide range of peripherals. The Programmable I/O (PIO) modules enable custom hardware logic and precise timing control that enhance your system’s flexibility. (robu.in ) Programming is simple and intuitive thanks to the USB 1.1 interface, which supports both host and device modes and allows easy drag‑and‑drop firmware loading. Despite its powerful capabilities, the Pico 2 W maintains efficient power usage and fits in a compact 21 mm × 51 mm board profile, making it excellent for breadboard prototypes, portable IoT devices, robotics controllers, and smart automation systems. (robu.in ) Whether you are a hobbyist, student, or engineer, the Raspberry Pi Pico 2 W with Header delivers performance, connectivity, and ease of use for next‑generation embedded projects.